3M

3M 5419 Low Static Polyimide Tape

3M™ Low Static Polyimide Film Tape 5419 is a 2.7 mil industrial grade tape product used for solder masking, creating release surfaces for parts cured at high temperatures, and other high temperature electrical applications. This product features low levels of static discharge during the unwinding and removing of the product making it an appropriate option for components that are susceptible to static discharge.

DuPont™ Kapton® polyimide film does not soften at elevated temperatures, thus the film provides an excellent release surface at elevated temperatures
No rework required, enabling high productivity
Protects surfaces helping reduce replacement parts

Color: Amber

Backing/Carrier Material: Polyimide Film

Adhesive Type: Silicone

TotalThickness: 2.7 mil

Overview
Customize
Features
Specifications
Compliance
Resources

Overview

Consult

Specify a finalized design or create a new one from scratch with our experienced converting experts.

Design

Pair our material sampling library with our precision converting capabilities to optimize and validate a prototype.

Produce

Rely on our top-tier suppliers, strict quality controls, and hands-on help to ensure your product's effectiveness throughout its lifecycle.

Customize

Customize This Material

Our wide range of converting capabilities allow us to take this material and transform it into the right width, length, shape or fabricated part to not only achieve ideal integration into your end use, but also optimize how you apply the material in your application. Our converting equipment paired with our expert engineering team will help you create the exact custom solution for your unique requirements.

To learn more about the most common converting services we offer, or to contact our team to start discussing your solution, please utilize the below links:

Tape Slitting

Die-Cutting

Custom Part Fabrication

Prototyping

Custom Length Rolls

Features

DuPont™ Kapton® polyimide film does not soften at elevated temperatures, thus the film provides an excellent release surface at elevated temperatures
No rework required, enabling high productivity
Protects surfaces helping reduce replacement parts
Employs a proprietary technology that results in extremely low electrostatic discharge at unwind and removal from the PWB
Meets flame retardant requirements of UL 510

Specifications

Color	Amber
Backing/Carrier Material	Polyimide Film
Adhesive Type	Silicone
Total Thickness	2.7 mil
Backing/Carrier Thickness	1 mil
Adhesive Thickness	1.7 mil
Adhesive Strength	20 oz/in
Tensile Strength	33 lb/in
Elongation	60%
Dielectric Strength	7,000 volts
Insulation Resistance	> 1 x 10⁶ ohms
Flame Retardant	Yes
Minimum Temperature Performance	-100°F
Maximum Temperature Performance	500°F
Low Static	Yes

Compliance

We value the importance of up to date an accurate regulatory information on the products we work with. For the most current Compliance and Regulatory information on your product of interest, please contact our experts for assistance.

Resources

Technical Data Sheet

Mask for printed circuit boards during wave solder or solder dip process
Used as release surface in fabrication of parts cured at elevated temperatures

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